PN Type Package Designator Pb-Free Packages - Manufacturing Conversion Datecode, Refer to Note 1 Type of Plating / Finish Matte Tin Annealing Process Minimum Plating Thickness Does this Microchip Pb-free device meet RoHS compliance for the following 6 materials: Pb, Hg, Cr6+, Cd, and PBB / PBDE Total Mass (g) STANDARD8L SOIC .150in0508Matte Tin150C / 1hr w/l 24 hours400 microinchesYes0.0780
MCP3001T-I/SN |
RFQ for MCP3001T-I/SN |
![]() |
| Technical/Catalog Information | MCP3001T-I/SN |
| Vendor | Microchip Technology (VA) |
| Category | Integrated Circuits (ICs) |
| Number of Bits | 10 |
| Package / Case | 8-SOIC (3.9mm Width) |
| Data Interface | Serial |
| Packaging | Cut Tape (CT) |
| Sampling Rate (Per Second) | 200k |
| Operating Temperature | -40°C ~ 85°C |
| Voltage Supply Source | Single |
| Number of Inputs and Type | 1 Pseudo-Differential, Unipolar |
| Number of Converters | 1 |
| Power Dissipation (Max) | - |
| Lead Free Status | Lead Free |
| Other Names | MCP3001T I SN MCP3001TISN MCP3001T I SNCT ND MCP3001TISNCTND MCP3001T-I/SNCT |
| Product | Manufacturers | Pack | D/C | ||||||||
| MCP3001T-I/SN | - | - | - |